HGS® (Hot Gas Sweep) is a unique, patented, vacuum chamber processing technique that is receiving critical acclaim in the United States Semiconductor Industry because of the dramatic improvement it is providing in three areas:

• The improvement of virgin yield at final sort by 2% to 5%.
• The extension of Mean Time Between Cleans by a factor of 2 to 4.
• The improvement of pump down times after wet cleans by at least 50%

The above results have been achieved by three distinct applications of HGS®

• In-situ particle removal from process chambers.
• Abatement of H2O and HBr in load locks.
• Expedited contaminant removal from chambers after process excursions and wet cleans.

Galiso realizes that the above claims are dramatic.  However, we invite you to visit our HGS®
Fab Results for customer supplied HGS® processing results.  Additionally, please visit the HGS Development History (you will need a Flash plug-in to view) to learn how HGS® was developed and proven effective.

To review the physics of HGS® Processing, please visit our Technology Overview below. To learn what steps need to be taken to bring the benefit of HGS® to your Fab.


Please visit Technology Overview.
Technology Overview Typical HGS® Applications
Successful HGS® Implementation
For Additional Information, call 1-800-854-3789 and ask for Ray Lesniewski
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