![]() |
Typical HGS® Applications |
Etch Chambers |
HGS has the ability to cause one to completely rethink how to condition a vacuum chamber both prior to staring wafer processing and during the wafer run. The more one understand the principles of HGS the more applications come to mind. We invite you to review this brief summary of typical applications and then attend one of our Seminars to become fully acquainted with the powerful results HGS can bring to your semiconductor manufacturing applications. |
|
|
| Centura® is a registered trademark of Applied Material Inc. |
Load Locks |
HBr Abatement The common problem of HBr back-streaming and out-gassing into the load lock as wafers are moved from the process chamber into the Load Lock, is deftly addressed through the application of HGS. The turbulent, viscous flow of heated HGS gas quickly removes HBr from the load lock and degasses wafers. Beta test at a Dallas Texas Fab demonstrated an extended life of the cassette handlers by a factor of 2, and also eliminated daily wipes of the load lock. Lastly, and perhaps most importantly, this HGS application reduces the health risk associated with exposure to HBr. |
Moisture Abatement
Load Locks are the single most significant source of entry for atmospheric contaminants during the semiconductor manufacturing process. The entry of atmospheric moisture into the load lock, and the subsequent migration of moisture into buffers and process chambers can adversely affect processing conditions. The use of HGS through the load lock on a periodic basis will eliminate this migration pattern and extend the life of the manufacturing cycle. |
Preclean Chambers Being essentially
an etch chamber, HGS can
bring the same benefit of the above Etch chamber summary to a preclean
chamber. A cleaner preclean
chamber minimizes the migration of contaminants to the processing chambers
of a high vacuum tool.
|