The Process
HGS® is a proven technology developed to improve
tool performance. The patented Hot Gas Sweep pulsates a hot, high
velocity viscous gas flow to the load lock and process chamber
sweeping out particles and expelling them via the process pump
by this volume of gas.
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Particle Management System
Over the past 3 years recognized
leaders in the semiconductor industry have seen remarkable improvements
in wafer production, die, yield, and cost containment by the application
of HGS® to their LAM 9600 TCP tools.
Here's how HGS® can Benefit your FAB
- Reduce Cost of Tool Ownership
- Extended MTBC
- Reduce Particle Contamination
- Greater Virgin Yield
- Improved Chamber Seasoning and Conditioning
HGS® users are experiencing 1.5 to over 3 times improvement in Mean
Time Between Cleans.
RF hours have increased to over 300 hours on average.
Greatly reduced particle contamination has confirmed die yield increases
of 1% to 2% in most applications. |
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